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New energy circuit board busbar PDU busbar DB busbar circuit board PCB

Parameters

    Product parameters:

    Number of floors: 4 layers

    Material: Copper

    Finished product thickness: 4.0MM

    Finished copper row thickness: 3.0MM

    Surface treatment: immersion gold

    Minimum aperture:

    Minimum line width:

    This product is used for new energy automotive battery panels, electric vehicle battery panels, PDU busbars, PDU control panels, EDM control panels, DB busbars, laminated busbars and other copper based circuit boards above new energy products.


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Product Details

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Engineering technical parameters

  

Technical project

Technical indicators of process capability
Surface treatmentElectroplated nickel gold, spray tin, chemical gold, carbon oil, gold finger, anti-oxidation, sinking tin, immersion silver
biggest size600mm×700mm
Minimum board size5mm×5 mm
Plate warpageSingle panel ≤ 1.0%, double panel ≤ 0.7%, multilayer board ≤ 0.5%
Minimum thickness & tolerance range0.2mm±0.08mm
 Minimum line width / line gap & tolerance rangeSpray tin plate:0.2mm±20%(8mil±0%)
Gold plate:0.075mm±20%(3mil±0%)
 Copper peel from the edge of the board0.5mm(20mil)
 Hole margin line edge0.3mm(12mil)
Minimum aperture & tolerance range0.2mm±.076mm(8mil±3mil)
Minimum Pitch & Tolerance Range0.4mm±.076mm(16mil±3mil)
 Copper thickness in the hole20-25um(0.79mil—1.0mil)
 Hole positioning deviation±0.076mm(l±3mil)
 Minimum punching hole diameterFR-4 plate thickness 1.0mm (40mil) or less: 1.0mm (40mil)
FR-4 plate thickness 1.2-3.0mm (48-120mil): 1.5mm (60mil)
 Minimum punch square specificationFR-4 CEM-3 plate thickness 1. 0mm (40mil) or less: 0.8 mm× 0.8 mm (32 mil× 32 mil)
FR-4 plate thickness 1.2-3.0mm (48-120mil): 1.0 mm× 1.0 mm (40mil× 40mil)
Silk screen line deviation±0.076mm(±3mil)
 Molding dimensional tolerance range Shape: ± 0.1mm (± 4mil), die shape: ± 0.05mm (± 2mil)
 V cutting alignment accuracy ± 0.2mm (± 8mil)
 product typeSingle-sided, double-sided, multi-layer
 Substrate FR-4, CEM-1, CEM-3, high frequency, aluminum based, iron based, copper based
 Processing thickness 0.2-3.5mm
 Copper substrate thickness 11um  35um  70um  105um
 Plate thickness ratio 8:1
V cut angle deviation ±5°
 V cutting sheet thickness range 0.4mm -3.2mm(16mil -128mil)
 Minimum SMT spacing 0.3mm(12mil)
 Minimum component mark font 0.15mm(6mil)
Welding ring unilateral minimum width (finished product) 0.15mm(6mil)
Pad minimum window 0.076mm(3mil)
Minimum green oil bridge ±0.076mm(±3mil)
Carbon oil board process data: 1. High impedance control range: 20K & plusmn; 10% 2. Hardness: 6H 3. Can withstand friction times: 200000 times or more

 


New energy circuit board busbar PDU busbar DB busbar circuit board PCB
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  • Copyright©2019 Shenzhen TongChuangXin Electronics Co.,Ltd / Shenzhen TongChuangXin precision circuit co, ltd
  • For Reference: ICP 19122574
  • Address:Building20-21,Xinwei No3 Industry Zone,Phoenix Village,Fuyong Town,Baoan District,Shenzhen,Guangdong,China
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